Semiconductor
Semiconductor Manufacturing Process Products
Back Grinding Tape
214D
This product is used to protect the circuit surface from scratches, chipping, cracks and contamination by external foreign matter when backside grinding (back grinding) the wafer.
| Product Name | Base Material | Thickness [mm] |
Adhesive Strength [N/25mm] SUS Weak Side | Adhesive Strength [N/25mm] SUS Strong Side |
Application | Technical Data |
|---|---|---|---|---|---|---|
| 214D | Polyester | 0.115 | 25 | 15 | Grinding and cleaning process of semiconductor wafer |  |
Dicing Tape
RMGU Series (UV Curing Type)
A tape for protecting and fixing the wafer during the semiconductor dicing process.
| Product Name | Base Material | Thickness [mm] |
Color | Adhesive Strength[mN/25mm] Before UV : SUS |
Adhesive Strength[mN/25mm] After UV : SUS |
Technical Data |
|---|---|---|---|---|---|---|
| RMGUY90 | PVC | 0.09 | Blue/Opaque | 600 | 900 | |
Tape for die bonding / mounting process
170 Series
This product is surface protection and fixing tape using polyimide base material with high heat resistance and silicone adhesive. Therefore, in the high-temperature environment, adhesive residue is extremely few and peeling is easy.
171
*Die (semiconductor element) Masking (surface protection) tape for reflow process
172
*Die (semiconductor element) and leadframe mounting fixing tape
| Product Name | Thickness [mm] | Structure | Adhesive Strength [N/25mm] SUS | Application | Notes | Technical Data |
|---|---|---|---|---|---|---|
| 171 | 0.065 | Polyimide film base Silicone adhesive layer Separator |
0.1 | Masking of semiconductor wafers | BTO | |
| 172 | 0.040 | Polyimide film base Silicone adhesive layer Separator |
8.0 | Fastening of semiconductor package lead frame | BTO | |
FPC 【Flexible Printed Circuits】 Material
| Product Name | Structure | Thickness （mm） |
Width × Length （mm）×（M） | Feature | Notes | Technical Data |
|---|---|---|---|---|---|---|
| SAR25C12 | Copper LCP | 0.037 | 300mm×20M | Heat resistance Low dielectric property Low moisture absorption |
BTO | |
| Product Name | Structure | Thickness LCP （mm） |
Thickness Copper （mm） | Feature | Notes | Technical Data |
|---|---|---|---|---|---|---|
| SAR CC | Copper LCP Copper | 0.025 | 0.012 | Heat resistance Low dielectric property Low moisture absorption |
BTO | |
Adhesive Sheet for FPC (Flexible Printed Circuit Board) bonding
SB Sheet Series
A Heat bonding film that has no tack at the beginning but can be bonded by heat. Adhesive applications such as semiconductor FPC materials.
| Product Name | Thickness [mm] | Structure | Adhesive Strength [N/cm] | Application | Notes | Technical Data |
|---|---|---|---|---|---|---|
| SBN35 | 0.035 | Epoxy Adhesive | 8.0 | For bonding flexible printed circuit board materials |
BTO | |
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